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Phys. Rev. Lett. 85, 2324–2327 (2000)

Fast Diffusion of H and Creation of Dangling Bonds in Hydrogenated Amorphous Silicon Studied by in situ ESR

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U. K. Das*, T. Yasuda, and S. Yamasaki
Joint Research Center for Atom Technology, 1-1-4 Higashi, Tsukuba, Ibaraki 305 0046, Japan

Received 2 February 2000; published in the issue dated 11 September 2000

The interaction of atomic hydrogen with a-Si:H films was studied by means of in situ ESR during H plasma treatment. H diffuses into the a-Si:H film and creates additional Si dangling bonds (1013cm-2). We observed a high diffusion coefficient (>10-10 cm2s-1) at the very initial stage of H treatment (<1 s). The resulting additional dangling bonds are spatially distributed (100nm) into the bulk film. The characteristic depth of dangling bond (db) distribution decreases with increasing H treatment temperature. The activated rate constants of db creation and annihilation reactions determine the distribution of additional dangling bonds at different treatment temperatures.

© 2000 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevLett.85.2324
DOI:
10.1103/PhysRevLett.85.2324
PACS:
61.43.Dq, 52.75.Rx, 66.30.Ny, 76.30.-v

*Email address: ukdas@jrcat.or.jp