Phys. Rev. Lett. 94, 066104 (2005) [4 pages]Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy ElectrodepositsReceived 18 November 2004; published 17 February 2005 The spontaneous growth of tin whiskers on electrodeposited tin-manganese alloy coatings has been observed. This growth is distinct from any previously reported whisker growth on either pure tin or other tin-based alloy electrodeposits. It has an extremely short incubation period of a few hours only, followed by a spectacularly rapid and profuse growth. During the whole period of whisker growth, the tin-manganese electrodeposits were found to be in a tensile residual stress state. This rules out the commonly accepted explanation of a compressive stress as the driving force for tin whisker growth. © 2005 The American Physical Society URL:
http://link.aps.org/doi/10.1103/PhysRevLett.94.066104
DOI:
10.1103/PhysRevLett.94.066104
PACS:
68.70.+w, 61.10.–i, 81.15.Pq
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